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3d And Circuit Integration Of Mems 1st Edition Masayoshi Esashi

  • SKU: BELL-38366346
3d And Circuit Integration Of Mems 1st Edition Masayoshi Esashi
$ 31.00 $ 45.00 (-31%)

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3d And Circuit Integration Of Mems 1st Edition Masayoshi Esashi instant download after payment.

Publisher: Wiley-VCH
File Extension: PDF
File size: 28.29 MB
Pages: 508
Author: Masayoshi Esashi
ISBN: 9783527346479, 3527346473
Language: English
Year: 2021
Edition: 1

Product desciption

3d And Circuit Integration Of Mems 1st Edition Masayoshi Esashi by Masayoshi Esashi 9783527346479, 3527346473 instant download after payment.

3D and Circuit Integration of MEMS Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.

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