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3d Ic Stacking Technology Banqiu Wu Ajay Kumar Sesh Ramaswami

  • SKU: BELL-5071212
3d Ic Stacking Technology Banqiu Wu Ajay Kumar Sesh Ramaswami
$ 31.00 $ 45.00 (-31%)

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3d Ic Stacking Technology Banqiu Wu Ajay Kumar Sesh Ramaswami instant download after payment.

Publisher: McGraw-Hill Professional;McGraw-Hill Education
File Extension: EPUB
File size: 10.63 MB
Pages: 373
Author: Banqiu Wu, Ajay Kumar, Sesh Ramaswami
ISBN: 9780071741958, 007174195X
Language: English
Year: 2011

Product desciption

3d Ic Stacking Technology Banqiu Wu Ajay Kumar Sesh Ramaswami by Banqiu Wu, Ajay Kumar, Sesh Ramaswami 9780071741958, 007174195X instant download after payment.

The latest advances in three-dimensional integrated circuit stacking technology

With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.

3D IC Stacking Technology covers:

  • High density through silicon stacking (TSS) technology
  • Practical design ecosystem for heterogeneous 3D IC products
  • Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack
  • Process integration for TSV manufacturing
  • High-aspect-ratio silicon etch for TSV
  • Dielectric deposition for TSV
  • Barrier and seed deposition
  • Copper...
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