3d Interconnect Architectures For Heterogeneous Technologies Modeling And Optimization Lennart Bamberg by Lennart Bamberg, Jan Moritz Joseph, Alberto García-ortiz, Thilo Pionteck 9783030982317, 9783030982287, 9783030982294, 3030982319, 3030982289, 3030982297 instant download after payment.

Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. 

The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow’s 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.