logo

EbookBell.com

Most ebook files are in PDF format, so you can easily read them using various software such as Foxit Reader or directly on the Google Chrome browser.
Some ebook files are released by publishers in other formats such as .awz, .mobi, .epub, .fb2, etc. You may need to install specific software to read these formats on mobile/PC, such as Calibre.

Please read the tutorial at this link:  https://ebookbell.com/faq 


We offer FREE conversion to the popular formats you request; however, this may take some time. Therefore, right after payment, please email us, and we will try to provide the service as quickly as possible.


For some exceptional file formats or broken links (if any), please refrain from opening any disputes. Instead, email us first, and we will try to assist within a maximum of 6 hours.

EbookBell Team

A Onesemester Course In Modeling Of Vlsi Interconnections Goel

  • SKU: BELL-5275480
A Onesemester Course In Modeling Of Vlsi Interconnections Goel
$ 31.00 $ 45.00 (-31%)

0.0

0 reviews

A Onesemester Course In Modeling Of Vlsi Interconnections Goel instant download after payment.

Publisher: Momentum Press
File Extension: PDF
File size: 70.68 MB
Pages: 362
Author: Goel, Ashok K
ISBN: 9781606505120, 9781606505137, 1606505122, 1606505130
Language: English
Year: 2015

Product desciption

A Onesemester Course In Modeling Of Vlsi Interconnections Goel by Goel, Ashok K 9781606505120, 9781606505137, 1606505122, 1606505130 instant download after payment.

Quantitative understanding of the parasitic capacitances and inductances, and the resultant propagation delays and crosstalk phenomena associated with the metallic interconnections on the very large scale integrated (VLSI) circuits has become extremely important for the optimum design of the state-of-the-art integrated circuits. More than 65 percent of the delays on the integrated circuit chip occur in the interconnections and not in the transistors on the chip. Mathematical techniques to model the parasitic capacitances, inductances, propagation delays, crosstalk noise, and electromigration-induced failure associated with the interconnections in the realistic high-density environment on a chip will be discussed. A One-Semester Course in Modeling of VLSI Interconnections also includes an overview of the future interconnection technologies for the nanotechnology circuits

Related Products