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Chiplet Design And Heterogeneous Integration Packaging John H Lau

Name: Chiplet Design And Heterogeneous Integration Packaging John H Lau
SKU: BELL-49440414
Price: 31.00 USD
Availability: InStock
Rating: 4.7 (16 reviews)

SKU: BELL-49440414

$ 31.00 ~~$ 45.00~~ (-31%)

4.7

16 reviews

Chiplet Design And Heterogeneous Integration Packaging John H Lau instant download after payment.

Publisher: Springer

File Extension: PDF

File size: 30.19 MB

Pages: 541

Author: John H. Lau

ISBN: 9789811999161, 9811999163

Language: English

Year: 2023

Product desciption

Chiplet Design And Heterogeneous Integration Packaging John H Lau by John H. Lau 9789811999161, 9811999163 instant download after payment.

The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.