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Design And Modeling For 3d Ics And Interposers Madhavan Swaminathan

  • SKU: BELL-5147348
Design And Modeling For 3d Ics And Interposers Madhavan Swaminathan
$ 31.00 $ 45.00 (-31%)

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Design And Modeling For 3d Ics And Interposers Madhavan Swaminathan instant download after payment.

Publisher: World Scientific Publishing Company
File Extension: PDF
File size: 34.44 MB
Pages: 380
Author: Madhavan Swaminathan, Ki Jin Han
ISBN: 9789814508599, 9814508594
Language: English
Year: 2014

Product desciption

Design And Modeling For 3d Ics And Interposers Madhavan Swaminathan by Madhavan Swaminathan, Ki Jin Han 9789814508599, 9814508594 instant download after payment.

3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.

Readership: Graduate students, academics, researchers in electrical and electronics engineering, computer engineering, semiconductors and packaging.

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