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Developments In Surface Contamination And Cleaning Particle Deposition Control And Removal Kohli

  • SKU: BELL-4322076
Developments In Surface Contamination And Cleaning Particle Deposition Control And Removal Kohli
$ 31.00 $ 45.00 (-31%)

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Developments In Surface Contamination And Cleaning Particle Deposition Control And Removal Kohli instant download after payment.

Publisher: William Andrew Publishing
File Extension: PDF
File size: 5.36 MB
Pages: 301
Author: Kohli, Rajiv; Mittal, Kashmiri L.(eds.)
ISBN: 9781437778304, 9781437778311, 1437778305, 1437778313
Language: English
Year: 2010

Product desciption

Developments In Surface Contamination And Cleaning Particle Deposition Control And Removal Kohli by Kohli, Rajiv; Mittal, Kashmiri L.(eds.) 9781437778304, 9781437778311, 1437778305, 1437778313 instant download after payment.

The authors have brought together the work of experts from different industry sectors and backgrounds to provide a state-of-the-art survey and best practice guidance for scientists and engineers engaged in surface cleaning or handling the consequences of surface contamination. Topics covered include:
  • Systems analysis approach to contamination control
  • Physical factors that influence the behavior of particle deposition in enclosures
  • Overview of current yield models and description of advanced models
  • Types of strippable coatings
  • Properties and applications of these coatings for removal of surface contaminants
  • In-depth coverage of ultrasonic cleaning
  • Contamination and cleaning issues at the nanoscale
  • Experimental results illustrating the impact of model parameters on the removal of particle contamination The expert contributions in this book provide a valuable source of information on the current status and recent developments in surface contamination and cleaning. This book will be of value to industry, government and academic personnel involved in research and development, manufacturing, process and quality control, and procurement specifications across sectors including microelectronics, aerospace, optics, xerography, and joining (adhesive bonding).
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