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High Dielectric Constant Materials VLSI MOSFET Applications 2005th Edition by Howard Huff, David Gilmer ISBN 3540210814‎ 978-3540210818

  • SKU: BELL-2188858
High Dielectric Constant Materials VLSI MOSFET Applications 2005th Edition by Howard Huff, David Gilmer ISBN 3540210814‎ 978-3540210818
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High Dielectric Constant Materials VLSI MOSFET Applications 2005th Edition by Howard Huff, David Gilmer ISBN 3540210814‎ 978-3540210818 instant download after payment.

Publisher: Springer
File Extension: PDF
File size: 9.6 MB
Pages: 723
Author: Howard Huff, David Gilmer
ISBN: 9783540210818, 3540210814
Language: English
Year: 2004
Edition: 1

Product desciption

High Dielectric Constant Materials VLSI MOSFET Applications 2005th Edition by Howard Huff, David Gilmer ISBN 3540210814‎ 978-3540210818 by Howard Huff, David Gilmer 9783540210818, 3540210814 instant download after payment.

High Dielectric Constant Materials: VLSI MOSFET Applications 2005th Edition by Howard Huff, David Gilmer - Ebook PDF Instant Download/Delivery: 3540210814,‎ 978-3540210818

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Product details:

ISBN 10: 3540210814‎ 

ISBN 13: 978-3540210818

Author: Howard Huff, David Gilmer

Issues relating to the high-K gate dielectric are among the greatest challenges for the evolving International Technology Roadmap for Semiconductors (ITRS). More than just an historical overview, this book will assess previous and present approaches related to scaling the gate dielectric and their impact, along with the creative directions and forthcoming challenges that will define the future of gate dielectric scaling technology. Topics include: an extensive review of Moore's Law, the classical regime for SiO2 gate dielectrics; the transition to silicon oxynitride gate dielectrics; the transition to high-K gate dielectrics (including the drive towards equivalent oxide thickness in the single-digit nanometer regime); and future directions and issues for ultimate technology generation scaling. The vision, wisdom, and experience of the team of authors will make this book a timely, relevant, and interesting, resource focusing on fundamentals of the 45 nm Technology Generation and beyond.

Table of contents:

  1. Classical Regime for SiO₂

  2. Brief Notes on the History of Gate Dielectrics in MOS Devices

  3. SiO₂ Based MOSFETs: Film Growth and Si—SiO₂ Interface Properties

  4. Oxide Reliability Issues

  5. The Economic Implications of Moore's Law

  6. Transition to Silicon Oxynitrides

  7. Gate Dielectric Scaling to 2.0—1.0 nm: SiO₂ and Silicon Oxynitride

  8. Optimal Scaling Methodologies and Transistor Performance

  9. Silicon Oxynitride Gate Dielectric for Reducing Gate Leakage and Boron Penetration Prior to High-k Gate Dielectric Implementation

  10. Transition to High-k Gate Dielectrics

  11. Alternative Dielectrics for Silicon-Based Transistors: Selection Via Multiple Criteria

  12. Materials Issues for High-k Gate Dielectric Selection and Integration

  13. Designing Interface Composition and Structure in High Dielectric Constant Gate Stacks

  14. Electronic Structure of Alternative High-k Dielectrics

  15. Physicochemical Properties of Selected 4d, 5d, and Rare Earth Metals in Silicon

  16. High-k Gate Dielectric Deposition Technologies

  17. Issues in Metal Gate Electrode Selection for Bulk CMOS Devices

  18. CMOS IC Fabrication Issues for High-k Gate Dielectric and Alternate Electrode Materials

  19. Characterization and Metrology of Medium Dielectric Constant Gate Dielectric Films

  20. Electrical Measurement Issues for Alternative Gate Stack Systems

  21. High-k Gate Dielectric Materials Integrated Circuit Device Design Issues

  22. Future Directions for Ultimate Scaling Technology Generations

  23. High-k Crystalline Gate Dielectrics: A Research Perspective

  24. High-k Crystalline Gate Dielectrics: An IC Manufacturer's Perspective

  25. Advanced MOS-Devices

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Tags: Howard Huff, David Gilmer, High, Dielectric, Constant, Materials, VLSI, MOSFET, Applications

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