Integrated Passive Component Technology Richard K Ulrich Leonard W Schaper by Richard K. Ulrich, Leonard W. Schaper 9780471244318, 9780471722939, 0471244317, 0471722936 instant download after payment.
- This is a thorough survey of the state-of-the-art in Integrated Passive Component Technology.
- Describes the processes available for creating integrated passives, measuring their properties, and applying them.
- Brings reader up to date in a fast-moving technology.
- Enables reader to implement the technology into a manufacturing environment.
- Covers existing and potential technologies for various substrate systems such as FR4, ceramic, and HDI.
- Describes applications favorable to integrated passives and the economic tradeoffs associated with their implementation.
Content:
Chapter 1 Introduction (pages 1–32): Richard K. Ulrich
Chapter 2 Characteristics and Performance of Planar Resistors (pages 33–54): Richard K. Ulrich
Chapter 3 Integrated Resistor Materials and Processes (pages 55–74): Richard K. Ulrich
Chapter 4 Dielectric Materials for Integrated Capacitors (pages 75–99): Richard K. Ulrich
Chapter 5 Size and Configuration of Integrated Capacitors (pages 101–111): Richard K. Ulrich
Chapter 6 Processing Integrated Capacitors (pages 113–144): Richard K. Ulrich
Chapter 7 Defects and Yield Issues (pages 145–151): Richard K. Ulrich
Chapter 8 Electrical Performance of Integrated Capacitors (pages 153–176): Richard K. Ulrich and Leonard W. Schaper
Chapter 9 Decoupling (pages 177–190): Leonard W. Schaper
Chapter 10 Integrated Inductors (pages 191–245): Geert J. Carchon and Walter De Raedt
Chapter 11 Modeling of Integrated Inductors and Resistors for Microwave Applications (pages 247–291): Zhenwen Wang, M. Jamal Deen and A. H. Rahal
Chapter 12 Other Applications and Integration Technologies (pages 293–325): Elizabeth Logan, Geert J. Carchon, Walter De Raedt, Richard K. Ulrich and Leonard W. Schaper
Chapter 13 The Economics of Embedded Passives (pages 327–359): Peter A. Sandborn
Chapter 14 The Future of Integrated Passives (pages 361–371): Richard K. Ulrich
