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Materials For Information Technology Devices Interconnects And Packaging Engineering Materials And Processes 1st Edition Ehrenfried Zschech Editor

  • SKU: BELL-2197644
Materials For Information Technology Devices Interconnects And Packaging Engineering Materials And Processes 1st Edition Ehrenfried Zschech Editor
$ 31.00 $ 45.00 (-31%)

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Materials For Information Technology Devices Interconnects And Packaging Engineering Materials And Processes 1st Edition Ehrenfried Zschech Editor instant download after payment.

Publisher: Springer
File Extension: PDF
File size: 13.29 MB
Pages: 490
Author: Ehrenfried Zschech (Editor), Caroline Whelan (Editor), Thomas Mikolajick (Editor)
ISBN: 1852339411, 9781852339418
Language: English
Year: 2005
Edition: 1st Edition.

Product desciption

Materials For Information Technology Devices Interconnects And Packaging Engineering Materials And Processes 1st Edition Ehrenfried Zschech Editor by Ehrenfried Zschech (editor), Caroline Whelan (editor), Thomas Mikolajick (editor) 1852339411, 9781852339418 instant download after payment.

This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries.

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