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Microvias For Low Cost High Density Interconnects 1st Edition John H Lau

Name: Microvias For Low Cost High Density Interconnects 1st Edition John H Lau
SKU: BELL-1130992
Price: 31.00 USD
Availability: InStock
Rating: 4.8 (104 reviews)

SKU: BELL-1130992

$ 31.00 ~~$ 45.00~~ (-31%)

4.8

104 reviews

Microvias For Low Cost High Density Interconnects 1st Edition John H Lau instant download after payment.

Publisher: McGraw-Hill Professional

File Extension: PDF

File size: 11.5 MB

Pages: 549

Author: John H. Lau, S.W. Ricky Lee

ISBN: 9780071363273, 0071363270

Language: English

Year: 2001

Edition: 1

Product desciption

Microvias For Low Cost High Density Interconnects 1st Edition John H Lau by John H. Lau, S.w. Ricky Lee 9780071363273, 0071363270 instant download after payment.

The first comprehensive and in-depth guide to microvia and wafer level chip scale package (WLCSP) technologies. This reference gives you cutting edge information on the most important developments and latest research results in applying the microvia and WLCSP technologies to low-cost and high-density interconnects. For professionals active in microvia and WLCSP research and development, those who wish to master microvia and WLCSP problem solving methods, and those demanding a cost-effective design and high-yield manufacturing process for their low-cost and high-density interconnect systems, here is up-to-the-minute coverage of all aspects of this fascinating field.