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Reflow Soldering Processes Smt Bga Csp And Flip Chip Technologies Ningcheng Lee

  • SKU: BELL-4120846
Reflow Soldering Processes Smt Bga Csp And Flip Chip Technologies Ningcheng Lee
$ 31.00 $ 45.00 (-31%)

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Reflow Soldering Processes Smt Bga Csp And Flip Chip Technologies Ningcheng Lee instant download after payment.

Publisher: Newnes
File Extension: PDF
File size: 12.65 MB
Pages: 273
Author: Ning-Cheng Lee
ISBN: 9780080492247, 008049224X
Language: English
Year: 2002

Product desciption

Reflow Soldering Processes Smt Bga Csp And Flip Chip Technologies Ningcheng Lee by Ning-cheng Lee 9780080492247, 008049224X instant download after payment.

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