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4.8
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ISBN 10: 0071445595
ISBN 13: 978-0071445597
Author: Hwaiyu Geng
This handbook will provide engineers with the principles, applications, and solutions needed to design and manage semiconductor manufacturing operations. Consolidating the many complex fields of semiconductor fundamentals and manufacturing into one volume by deploying a team of world class specialists, it allows the quick look up of specific manufacturing reference data across many subdisciplines
Acknowledgments
Part 1 Semiconductor Fundamentals and Basic Materials
Chapter 1. How Semiconductor Chips Are Made Hwaiyu Geng, Lin Zhou
1.1. Introduction
1.2. What Is a Chip
1.3. Moore's Law
1.4. How Chips Are Designed
1.5. Where Chips Are Made
1.6. How Chips Are Made
References
Chapter 2. IC Design Ilsun Park
2.1. Introduction
2.2. Types of ICs
2.3. The P/N Junction
2.4. The Transistor
2.5. Designing an IC
2.6. Future Trends and Issues in IC Design
References
Chapter 3. Silicon Substrates for Semiconductor Manufacturing K.V.Ravi
3.1. Introduction
3.2. Key Attributes of Silicon as a Substrate Material
3.3. The Basics of Silicon Wafer Manufacture
3.4. Silicon as a Substrate Material
3.5. Key Issues and Challenges in the Manufacture of Silicon Substrates
3.6. Conclusions
References
Chapter 4. Copper, Low-K Dielectrics, and Their Reliability Hazara S. Rathore, Kaushik Chanda
4.1. Introduction
4.2. Copper Interconnect Technology
4.3. Low-k Dielectrics Technology
4.4. Copper/Low-κ Dielectrics Reliability
References
Chapter 5. Fundamentals-Silicide Formation on Si L. P.Ren, King N.Tu
5.1. Introduction
5.2. What Are the Fundamentals of Silicidation on Si?
5.3. Future Trends and Nanosilicide Formation
5.4. Conclusions
References
Chapter 6. Plasma Process Control David J.Coumou
6.1. Introduction
6.2. Fundamentals of Plasma Generation and Process Control
6.3. Process Control and Metrology
6.4. Properties of Dry Etch Process
6.5. Future Trends and Conclusions
References
Chapter 7. Vacuum Technology Peter Biltoft
7.1. Vacuum Technology Overview
7.2. Methods for Measuring Subatmospheric Pressure
7.3. Methods for Creating a Vacuum
7.4. Vacuum System Components
7.5. Leak Detection
7.6. Design of a Vacuum System
7.7. Future Trends and Conclusions
Further Reading
Information Resources
Chapter 8. Photomask Charles Howard
8.1. Introduction
8.2. Photomask Fundamentals
8.3. Photomask Equipment
8.4. Operations, Economics, Safety, and Maintenance Considerations
8.5. Future Trends and Conclusions
Bibliography
Part 2 Wafer Processing
Chapter 9. Microlithography Chris A. Mack
9.1. The Lithographic Process
9.2. Image Formation in Optical Lithography
9.3. Photoresist Chemistry
9.4. Linewidth Control
9.5. The Limits of Optical Microlithography
Further Reading
Chapter 10. Ion Implantation and Rapid Thermal Processing Michael Graf
10.1. Overview
10.2. Components of an Ion Implantation System
10.3. Endstation Architectures
10.4. Key Process and Manufacturing Issues
10.5. Resources in Ion Implantation
References
Chapter 11. Wet Etching Peng Zhang
11.1. Introduction
11.2. HF-Based Etching Chemistry
11.3. Metal Etching
11.4. Wet Etching for Compound Semiconductor
11.5. Equipment for Wet Etch
11.6. Environmental, Health, and Safety Issues
References
Chapter 12. Plasma Etching Shouliang Lai
12.1. Introduction
12.2. Plasma Etching in Silicon-Based IC Devices
12.3. Plasma Etching in Si-Based MEMS Devices
12.4. Plasma Etching in III-V Compound Semiconductors
12.5. Endpoint Detection in Plasma Etching
12.6. Conclusions
Acknowledgments
References
Chapter 13. Physical Vapor Deposition Florian Solzbacher
13.1. Introduction to Physical Vapor Deposition PVD
13.2. Fundamentals of PVD Processes
13.3. Vacuum Evaporation
13.4. Evaporator Equipment
13.5. Layers Deposited Using Evaporation and Their Properties
13.6. Sputtering
13.7. Sputter Equipment
13.8. Layers Deposited Using Sputtering
13.9. Atomic Layer Deposition-New Perspectives for Thin Film Deposition Techniques
13.10. Summary and Outlook
References
Chapter 14. Chemical Vapor Deposition Edward J. McInerney
14.1. Introduction
14.2. Theory
14.3. Components of a CVD System
14.4. Precoating and Cleaning
14.5. Troubleshooting
14.6. Future Trends
References
Chapter 15. Epitaxy Jamal Ramdani, Giovanni Vaccari
15.1. Introduction
15.2. Silicon Epitaxy for Advanced CMOS Technology
15.3. Manufacturing
15.4. Safety and Environmental Health
15.5. Future Epitaxy Trends
15.6. Conclusions
References
Further Reading
Chapter 16. ECD Fundamentals Tom Ritzdorf, John Klocke
16.1. Introduction
16.2. Fundamental ECD Technology (How Plating Works)
16.3. Benefits of Copper Damascene ECD Processing
16.4. Integration of Copper ECD into the Production Line
16.5. Additional Considerations for Copper ECD Processing
16.6. Future Trends
16.7. Summary
References
Chapter 17. Chemical Mechanical Planarization Timothy S. Dyer
17.1. Introduction to CMP
17.2. Most Common CMP Processes
17.3. Review of CMP Process Control
17.4. Post-CMP Wafer Cleaning
17.5. Common CMP Platforms and Tools
17.6. CMP Process Waste Management
17.7. Future Trends and Conclusions
Further Reading
Information Resources
Chapter 18. Wet Cleaning Andrew Machamer 1S.1
18.1. Overview and Background of Wet Cleaning
18.2. Typical Semiconductor Manufacturing Wet Cleaning Processes
18.3. Wet Cleaning Equipment Technology
18.4. Future Trends and Conclusions
References
Part 3 Final Manufacturing
Chapter 19. Inspection, Measurement, and Test Donald W. Blair
19.1. Introduction-Overview on Testing Equipment
19.2. Fundamentals of Test Equipment and Manufacturing Automation Systems
19.3. How to Prepare, Plan, Specify, Select Vendor, and Purchase Test Equipment
19.4. What Are Operation, Safety, Calibration, and Maintenance Considerations?
19.5. Future Trends and Conclusions
Acknowledgment to Authors
Further Reading
Information Resources
Chapter 20. Grinding, Stress Relief, and Dicing Kazuhisa Arai, Yoshikazu Kobayashi, Hideaki Otani
20.1. Introduction
20.2. Grinding Technology Overview
20.3. A General Look at Grinders
20.4. Dicing Overview
20.5. Dicing Saw Overview
20.6. Fabrication Equipment Requirements
20.7. Thinning
20.8. All in One System
20.9. Future Technology Trends
Further Reading
Chapter 21. Packaging Dietrich Tönnies, Michael Töpper
21.1. Introduction
21.2. Packaging Evolution
21.3. Wafer Bumping and Redistribution Technology
21.4. Case Studies
21.5. Optoelectronics and MEMS Packaging
References
Bibliography
Part 4 Nanotechnology, MEMS, and FPD
Chapter 22. Nanotechnology and Nanomanufacturing Zhong L. Wang
22.1. What Is Nanotechnology?
22.2. Nanotechnology and Biotechnology
22.3. Nanomanufacturing: Approaches and Challenges
22.4. Nanomanufacturing-Going Beyond the Engineering Process
Acknowledgment
References
Chapter 23. Fundamentals of Microelectromechanical Systems Michael A. Huff
23.1. Introduction
23.2. Technology Fundamentals of MEMS
23.3. How Are MEMS Made?
23.4. What Are the Applications of MEMS?
23.5. Future Trends
23.6. Conclusions
References
Other Information
Chapter 24. Flat-Panel Display Technology and Manufacturing David N. Liu
24.1. Introduction
24.2. Definitions
24.3. What Are the Fundamentals and Principles of FPD?
24.4. What Is the Manufacturing Process?
24.5. Future Trends and Conclusions
Further Reading
Part 5 Gases and Chemicals
Chapter 25. Specialty Gas and CDA Systems Wayne D. Curcie
25.1. Introduction
25.2. Semiconductor Manufacturing Process Requirements
25.3. Code Requirements and Other General Design Considerations
25.4. Specialty Gas Dispense and Distribution
25.5. Implementation
25.6. Future Trends on Specialty Gas Systems
25.7. Clean Dry Air
25.8. Conclusion
Acknowledgments
References
Further Reading
Chapter 26. Waste Gas Abatement Systems Joseph D. Sweeney
26.1. Introduction
26.2. Fundamentals and Principles
26.3. Major Components
26.4. Important Considerations
26.5. Future Trends
References
Chapter 27. PFC Abatement James C. Cox
27.1. Perfluorocarbon Compounds
27.2. PFC Emission Reduction Strategies
27.3. PFC Abatement Theory
27.4. Catalytic Abatement
References
Chapter 28. Chemical and Slurry Handling Systems Kristin Cavicchi, Dan Barsness
28.1. Introduction
28.2. Elements of Chemical and Slurry Handling Systems and Important Terms
28.3. Equipment
28.4. High-Purity Chemical Blending
28.5. System Purity
28.6. CMP Slurry Systems
28.7. Conclusions
References
Chapter 29. Fluid Handling Components for High Purity Liquid Chemicals and Slurries Charles K. Gould
29.1. Introduction
29.2. Materials of Construction for Fluid Handling Components
29.3. Metal Impurities, Total Oxidizable Carbon, and Particle Contamination
29.4. Industry Test Standards and Protocols
29.5. Fluid Handling Components
29.6. Fluid Measurement Devices
29.7. Process Control Applications
29.8. Conclusions
Further Reading
Chapter 30. Fundamentals of Ultrapure Water David J. Albrecht
30.1. Introduction
30.2. Unit Operations for UDI Systems
30.3. Initial Feedwater
30.4. Pretreatment
30.5. Primary Treatment
30.6. Final Treatment, Polishing, and Distribution
30.7. Future Trends
References
Part 6 Fab Yield, Operations, and Facilities
Chapter 31. Yield Management Bo Li, Wayne Carriker
31.1. Introduction
31.2. What Is Yield Management and Why It Is Important?
31.3. What Are the Elements that Yield Management Consists of and How Are Yield Management Systems Implemented?
31.4. What Are the Considerations in Optimizing Yield Management Systems?
31.5. Trends and Conclusions
Further Reading
Chapter 32. Automated Material Handling System Clint Haris
32.1. Introduction
32.2. Principal Components of an AMHS
32.3. The Design of an AMHS
32.4. Operational Considerations
32.5. Future Trends
Chapter 33. CD Metrology and CD-SEM Ram Peltinov, Mina Menaker
33.1. Introduction
33.2. Fundamental CD Metrology Concepts
33.3. Basic Concepts of CD-SEM System
33.4. CD-SEM Specification and Selection Process
33.5. Future Trends and Conclusions
References
Chapter 34. Six Sigma Bruno Scibilia, Yoan Dupret
34.1. What Is Six Sigma?
34.2. Fundamental Strengths of Six Sigma
34.3. The Major DMAIC Phases
34.4. Design for Six Sigma (DFSS)
34.5. Some Applications
34.6. Future Trends and Conclusions
Bibliography
Chapter 35. Advanced Process Control Robert H. McCafferty
35.1. Technology Overview
35.2. Fundamentals of Advanced Process Control
35.3. Applications
35.4. Application Considerations
35.5. Future Trends and Conclusions
References
Chapter 36. Environmental, Health, and Safety Considerations in Semiconductor Fabrication Facilities Brett J. Davis, Steven R. Trammell
36.1. Introduction
36.2. EHS Hazards from Semiconductor Manufacturing
36.3. EHS Regulations Applicable to Semiconductor Manufacturers
36.4. Beyond Regulatory Compliance
36.5. The Future of Semiconductor EHS
Further Reading
Information Resources
Chapter 37. Plan, Design, and Construction of a FAB Industrial Design and Construction
37.1. Introduction
37.2. Planning
37.3. Design
37.4. Construction
37.5. Conclusions
Chapter 38. Cleanroom Design and Construction Richard V. Pavlotsky, Stephen C. Beck
38.1. Introduction
38.2. Cleanroom Standards, Classifications, and Certification
38.3. Types of Cleanroom
38.4. Airflow Layouts and Patterns
38.5. Air Changes
38.6. Elements of a Cleanroom
38.7. Environmental Conditional Requirements
38.8. Process Contamination Control
38.9. Vibration and Noise Control
38.10. Magnetic and Electromagnetic Flux
38.11. Electrostatic Charge of Air and Surfaces
38.12. Life Safety
38.13. Computational Fluid Dynamics
38.14. Cleanroom Economics
38.15. Practical Problems and Solutions Samples
Further Reading
Information Resources
Chapter 39. Micro-Vibration and Noise Design Michael Gendreau, Hal Amick
39.1. Introduction
39.2. Measurement Methodology and Criteria
39.3. Vibration and Noise Sources
39.4. Foundation and Structural Design
39.5. Vibration and Noise Control in the Mechanical/Electrical/Process (MEP) Design
39.6. Acoustic Design
39.7. Tool Hook-Up
39.8. Purposes and Timing of Facility Vibration Surveys
39.9. Maturation of the Vibration and Noise Environment
39.10. Future Trends and Special Cases
Acknowledgments
References
Chapter 40. ESD Controls in Cleanroom Environments Larry Levit
40.1. Electrostatic Charge in Semiconductor Cleanrooms
40.2. Problems Resulting from Charge in Cleanrooms
40.3. Static Charge Generation
40.4. Insulators Versus Conductors
40.5. Cleanroom Electrostatic Management
40.6. Air Ionization for Static Charge Control
40.7. Electrostatic Measurement
40.8. Air Ionizer Applications
40.9. Conclusions
References
Chapter 41. Airborne Molecular Contamination Chris Muller
41.1. Introduction to Chemical Contamination and Definition of AMC
41.2. Classification of AMC
41.3. AMC Control Considerations
41.4. Implementing AMC Control
41.5. Gas-Phase Air Filtration Principles
41.6. Dry-Scrubbing Air Filtration Media
41.7. Chemical Filtration Equipment Designs
41.8. AMC Monitoring
41.9. AMC Control Application Areas
41.10. AMC Control Specifications and Standards
41.11. Specifying an AMC Control System
41.12. Final Considerations
41.13. Summary
References
Information Resources
Chapter 42. Particle Monitoring in Semiconductor Manufacturing Steven Kochevar, Jerry Gromala
42.1. Introduction
42.2. Particle Counter Theory of Operation
42.3. Specifying a Particle Counter
42.4. Special Considerations for Aerosol Applications
42.5. Special Considerations for Liquid Applications
42.6. Contamination Control Hierarchy
42.7. Airborne Molecular Contamination
42.8. Conclusions
Note
References
Chapter 43. Wastewater Neutralization Systems Richard E. Pinkowski
43.1. Introduction
43.2. Water and pH
43.3. Application Evaluation
43.4. Architecture of Standard pH Adjustment Systems
43.5. System Optimization
43.6. The Control System
43.7. Chemicals Used for pH Adjustment
43.8. The Application of pH Adjustment in Chemical Mechanical Polishing, Metal Reduction, and Fluoride Reduction
Bibliography
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