logo

EbookBell.com

Most ebook files are in PDF format, so you can easily read them using various software such as Foxit Reader or directly on the Google Chrome browser.
Some ebook files are released by publishers in other formats such as .awz, .mobi, .epub, .fb2, etc. You may need to install specific software to read these formats on mobile/PC, such as Calibre.

Please read the tutorial at this link:  https://ebookbell.com/faq 


We offer FREE conversion to the popular formats you request; however, this may take some time. Therefore, right after payment, please email us, and we will try to provide the service as quickly as possible.


For some exceptional file formats or broken links (if any), please refrain from opening any disputes. Instead, email us first, and we will try to assist within a maximum of 6 hours.

EbookBell Team

System On Package Miniaturization Of The Entire System 1st Edition Rao Tummala

  • SKU: BELL-2248566
System On Package Miniaturization Of The Entire System 1st Edition Rao Tummala
$ 31.00 $ 45.00 (-31%)

4.3

88 reviews

System On Package Miniaturization Of The Entire System 1st Edition Rao Tummala instant download after payment.

Publisher: McGraw-Hill Professional
File Extension: PDF
File size: 26.95 MB
Pages: 790
Author: Rao Tummala
ISBN: 0071459065
Language: English
Year: 2008
Edition: 1

Product desciption

System On Package Miniaturization Of The Entire System 1st Edition Rao Tummala by Rao Tummala 0071459065 instant download after payment.

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.

Related Products