logo

EbookBell.com

Most ebook files are in PDF format, so you can easily read them using various software such as Foxit Reader or directly on the Google Chrome browser.
Some ebook files are released by publishers in other formats such as .awz, .mobi, .epub, .fb2, etc. You may need to install specific software to read these formats on mobile/PC, such as Calibre.

Please read the tutorial at this link:  https://ebookbell.com/faq 


We offer FREE conversion to the popular formats you request; however, this may take some time. Therefore, right after payment, please email us, and we will try to provide the service as quickly as possible.


For some exceptional file formats or broken links (if any), please refrain from opening any disputes. Instead, email us first, and we will try to assist within a maximum of 6 hours.

EbookBell Team

Threedimensional Integration And Modeling A Revolution In Rf And Wireless Packaging 1st Edition Jonghoon Lee

  • SKU: BELL-2024204
Threedimensional Integration And Modeling A Revolution In Rf And Wireless Packaging 1st Edition Jonghoon Lee
$ 31.00 $ 45.00 (-31%)

4.0

6 reviews

Threedimensional Integration And Modeling A Revolution In Rf And Wireless Packaging 1st Edition Jonghoon Lee instant download after payment.

Publisher: Morgan and Claypool Publishers
File Extension: PDF
File size: 33.94 MB
Pages: 118
Author: Jong-Hoon Lee
ISBN: 1598292447
Language: English
Year: 2008
Edition: 1

Product desciption

Threedimensional Integration And Modeling A Revolution In Rf And Wireless Packaging 1st Edition Jonghoon Lee by Jong-hoon Lee 1598292447 instant download after payment.

This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules.

Related Products