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Vlsisoc Technologies For Systems Integration 17th Ifip Wg 105ieee International Conference On Very Large Scale Integration Vlsisoc 2009 Florianpolis Brazil October 1214 2009 Revised Selected Papers 1st Edition Ian Oconnor

  • SKU: BELL-4522242
Vlsisoc Technologies For Systems Integration 17th Ifip Wg 105ieee International Conference On Very Large Scale Integration Vlsisoc 2009 Florianpolis Brazil October 1214 2009 Revised Selected Papers 1st Edition Ian Oconnor
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Vlsisoc Technologies For Systems Integration 17th Ifip Wg 105ieee International Conference On Very Large Scale Integration Vlsisoc 2009 Florianpolis Brazil October 1214 2009 Revised Selected Papers 1st Edition Ian Oconnor instant download after payment.

Publisher: Springer-Verlag Berlin Heidelberg
File Extension: PDF
File size: 5.28 MB
Pages: 202
Author: Ian O’Connor, Junchen Liu, Jabeur Kotb (auth.), Jürgen Becker, Marcelo Johann, Ricardo Reis (eds.)
ISBN: 9783642231193, 9783642231209, 3642231195, 3642231209
Language: English
Year: 2011
Edition: 1

Product desciption

Vlsisoc Technologies For Systems Integration 17th Ifip Wg 105ieee International Conference On Very Large Scale Integration Vlsisoc 2009 Florianpolis Brazil October 1214 2009 Revised Selected Papers 1st Edition Ian Oconnor by Ian O’connor, Junchen Liu, Jabeur Kotb (auth.), Jürgen Becker, Marcelo Johann, Ricardo Reis (eds.) 9783642231193, 9783642231209, 3642231195, 3642231209 instant download after payment.

This book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, held in Florianópolis, Brazil, in October 2009. The 8 papers included in the book together with two keynote talks were carefully reviewed and selected from 27 papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research addressing the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.

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