Most ebook files are in PDF format, so you can easily read them using various software such as Foxit Reader or directly on the Google Chrome browser.
Some ebook files are released by publishers in other formats such as .awz, .mobi, .epub, .fb2, etc. You may need to install specific software to read these formats on mobile/PC, such as Calibre.
Please read the tutorial at this link: https://ebookbell.com/faq
We offer FREE conversion to the popular formats you request; however, this may take some time. Therefore, right after payment, please email us, and we will try to provide the service as quickly as possible.
For some exceptional file formats or broken links (if any), please refrain from opening any disputes. Instead, email us first, and we will try to assist within a maximum of 6 hours.
EbookBell Team
4.8
74 reviewsThis book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.
